PCB

Designers using BGA or Ball Grid Array ICs need HDI or High-Density Interconnect PCBs to make the most effective use of these high-density packages. Using multiple BGA components, when some of [...]

Designers generate ideas that fabricators and assemblers subsequently convert into reality. While it is an important responsibility for fabricators and assemblers to faithfully follow the [...]

From being purely mechanical assemblies, automotive vehicles have progressed to include electronic parts. A top brand automotive vehicle today contains about 150 control units consisting mostly [...]

What is Warpage For proper placement of SMT components, it is necessary that the PCB remain perfectly flat. For accurate placement, the pick-and-place machine must release the SMT component at [...]

Rush PCB, our customers and most others are accustomed to seeing and handling Integrated Circuits or ICs. However, what everyone sees and handles is really the external packaging, as the die or [...]

A designer uses electronic components for building up the circuit so that it functions properly. Rush PCB recommends dividing the entire exercise into three distinct activities: Component [...]

According to the assembly and testing experience gathered by Rush PCB, there can be several reasons why the newly assembled PCB fails to function as intended during testing. We list below the [...]

Most industries use DFMA or Design for Manufacturing and Assembly techniques to mainly minimize product cost through improvements in design and process. Two procedures make up the term—Design for [...]

Although manufacturers must deal with several variables when fabricating a Printed Circuit Board (PCB) including the solder mask, silk screen, copper width and weight, laminates form the [...]

In the Printed Circuit Board (PCB) assembly process, the most important part is the deposition of solder paste on the board. The aim of the process is to deposit an accurate amount of solder [...]