PCB Assembly Rework
Ball Grid Array (BGA) Rework
Occasionally, BGA assemblies require modification, or rework. RUSH PCB has the know-how and experience with BGAs to do it right and preserve your assembly’s robust reliability.
Reworking and/or Replacing a BGA
PCB Assembly Rework, When reworking the solder connections underneath the BGA, its solder needs to be heated for reflow, without damaging the PCB itself or the other components on the board. This involves sending the heat to melt the solder through the BGA.
However, so that the PCB is not thermally shock, the rework process begins with preheating the circuit board. Once the PCB itself has preheat, just enough extra heat is apply to the BGA to flow the solder underneath it, and then the BGA is remove from the PCB.
If the BGA is to be reuse, it has to be re-ball; the old solder is remove, and then new balls or spheres are attach to the BGA.
Only after the reworked printed circuit board is cleaned and inspected is it ready for shipment.
For more information on Ball Grid Array rework, contact us at firstname.lastname@example.org or call 1 408-496-6013.