Assembly Reliability

Assembly Reliability Pin-Through-Hole

PTH Issues

In this paragraph, PCB Assembly Relatibility care needs to be take when reworking the PCB (repairing or modifying the PCB),however, after it is finish. Heating the solder for removal  hole during repair has potential damage the joint connecting the annular rings around the hole-plating.
Wave soldering temperatures with lead free solder are critical. Tighter temperature settings are need because the solder, being lead free, has a higher melting temperature; if the process temperature is incorrectly set, either the solder want bond properly, or the components and board may be damage.

ASSEMBLY RELIABILITY

Mix Component Assembly Soldering

When both SMT and pin-through-the-hole devices are use on the same assembly, several steps are need for soldering:

RUSH PCB Inc Plate-Through-Hole Technology

RUSH PCB Inc is familiar with all aspects of Plate-Through-Hole technology.The engineers at RUSH PCB Inc work with you on engineering and design of your Plate-Through-Hole print circuit.
Let our engineers assist with your design for manufacturability (DFM) issues relate to PTH technology in your assemblies. Contact us at sales@rushpcb.com, or call us at 1 408-496-6013

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