HDI Technology in Hole

HDI Technology in Hole

hdi-capability1



High Density Interconnection

High Density Interconnection



Blind & Burried 9+2+9 Laser Drill

Blind & Burried 9+2+9 Laser Drill

Market Trend vs. Technology Solution

Market Trend vs. Technology Solution

HDI Process Flow

HDI Process Flow

Main Process of Build - up Layer

Main Process of Build – up Layer

Construction Materials

Construction Materials

Material Type

  • FR 4 Tetra Function ( Tg. 130 – 140 ℃ )
  • FR 4 High Tg ( Tg. 160 – 180 ℃ )
  • RCC ( Tg. 150 ℃ & Tg. 185 ℃ )
  • Ink ( VIL )
Comparison of Material

Comparison of Material

Comparison of Via Technologies

Comparison of Via Technologies

Comparison of Blind Via

Comparison of Blind Via

Prepreg

RCC

Build-up for 2 + N + 2

Build-up for 2 + N + 2

Through Hole

Inner Laser Via

Stack Hole

Inner Via Hole

Surface Laser Via

Laser Via Quality

Laser Via Quality

1+6+1 without buried, extend to 1+N+1

1+6+1 without buried, extend to 1+N+1

1+4+4+1 with buried via, extend to 1+N+N+1

1+4+4+1 with buried via, extend to 1+N+N+1

Black Oxide Treatment

Black Oxide Treatment

D.F. Strip

D.F. Strip

Etching

Etching

D.F. Exposure / Developing

D.F. Exposure / Developing

Dry Film Lamination

Dry Film Lamination

I.V.H.Grinding( for thickness >= 60 mil )

I.V.H.Grinding
( for thickness >= 60 mil )

I.V.H.Grinding( for thickness >= 60 mil )

Inner Via Hole Plugging
( for thickness >= 60 mil )

Electro Plating

Electro Plating

Electroless Copper Plating

Electroless Copper Plating

I.V.H.(Inner Via Hole) Drilling

I.V.H.(Inner Via Hole) Drilling

I.V.H.(Inner Via Hole) Drilling

I.V.H.(Inner Via Hole) Drilling

Blind via Capability

Blind via Capability

2+4+2 Staggered via, extend to 2+N+2

2+4+2 Staggered via, extend to 2+N+2

2+4+2 Staggered via, extend to 2+N+2

2+4+2 Staggered via, extend to 2+N+2

2+4+2 laser via on laser via

2+4+2 laser via on laser via

Solder Mask Printing

Solder Mask Printing

Dry Film Lamination

Dry Film Lamination

Lamination

Lamination

Prepreg Layup

Prepreg Layup

Black Oxide Treatment

Black Oxide Treatment

D.F. Exposure / Developing

D.F. Exposure / Developing

Dry film, Exposure & DES

Dry film, Exposure & DES

Electro Plating

Electro Plating

Desmear / Electroless Copper Plating

Desmear / Electroless Copper Plating

Laser Drlling for Blind Via

Laser Drilling for Blind Via

D.F. Strip

D.F. Strip

Etching

Etching

D.F. Exposure / Developing

D.F. Exposure / Developing

S/M Exposure / Developing

S/M Exposure / Developing

Surface Finish

Surface Finish

Symbol Mask Printing

Symbol Mask Printing

Inspection

Inspection