HDI Technology in Hole

HDI Technology in Hole

High Density Interconnection


















High Density Interconnection


















Blind & Burried 9+2+9 Laser Drill









Blind & Burried 9+2+9 Laser Drill









Market Trend vs. Technology Solution



Market Trend vs. Technology Solution



HDI Process Flow



HDI Process Flow



Main Process of Build - up Layer



Main Process of Build – up Layer



Construction Materials
Construction Materials
Material Type
Material Type
- FR 4 Tetra Function ( Tg. 130 – 140 ℃ )
- FR 4 High Tg ( Tg. 160 – 180 ℃ )
- RCC ( Tg. 150 ℃ & Tg. 185 ℃ )
- Ink ( VIL )
Comparison of Material
Comparison of Material
Prepreg | RCC | |
Low Cost | ++ | - |
Strength | ++ | + |
Hole wall roughness | - | + |
Laminating control | + | - |
Dielectric thickness | 45um ~ | 30um ~ 80um |
Smear residue on target pad | - | ++ |
Dielectric constant | 3.9 ~ 4.7 | 3.2 ~ 3.8 |
Shelf time | ++ | + |
Working PNL size | ++ | + |
Comparison of Via Technologies
Comparison of Via Technologies
Mechanical Drilling | Laser Drilling | |
Low Cost in Equipment | ++ | + |
Low Cost in Production | + | ++ |
Required Facilities | Drilling Machine | Laser Machine |
Consumable | Drill Bits, Backup Board | None |
Aspect Ratio | 9 | 1 |
Via Size Capacity | 200 um~ | 50~100um |
Speed | 140 H/min | 20,000 H/min |
Throughput | - | + |
Comparison of Blind Via






Comparison of Blind Via
Prepreg
Prepreg



RCC
RCC



Build-up for 2 + N + 2


















Build-up for 2 + N + 2
Through Hole
Through Hole



Inner Laser Via
Inner Laser Via



Stack Hole
Stack Hole






Inner Via Hole
Inner Via Hole



Surface Laser Via
Surface Laser Via



Laser Via Quality



Laser Via Quality
Laser Via Quality



1+6+1 without buried, extend to 1+N+1



1+6+1 without buried, extend to 1+N+1



1+4+4+1 with buried via, extend to 1+N+N+1



1+4+4+1 with buried via, extend to 1+N+N+1
1+4+4+1 with buried via, extend to 1+N+N+1



Black Oxide Treatment



Black Oxide Treatment



D.F. Strip
D.F. Strip
Etching



Etching



D.F. Exposure / Developing



D.F. Exposure / Developing



Dry Film Lamination



Dry Film Lamination



I.V.H.Grinding( for thickness >= 60 mil )



I.V.H.Grinding
( for thickness >= 60 mil )
( for thickness >= 60 mil )



I.V.H.Grinding( for thickness >= 60 mil )



Inner Via Hole Plugging
( for thickness >= 60 mil )
( for thickness >= 60 mil )



Electro Plating



Electro Plating



Electroless Copper Plating



Electroless Copper Plating



I.V.H.(Inner Via Hole) Drilling



I.V.H.(Inner Via Hole) Drilling



I.V.H.(Inner Via Hole) Drilling



I.V.H.(Inner Via Hole) Drilling



Blind via Capability



Blind via Capability



2+4+2 Staggered via, extend to 2+N+2




2+4+2 Staggered via, extend to 2+N+2




2+4+2 Staggered via, extend to 2+N+2




2+4+2 Staggered via, extend to 2+N+2




2+4+2 laser via on laser via



2+4+2 laser via on laser via



Solder Mask Printing



Solder Mask Printing



Dry Film Lamination



Dry Film Lamination



Lamination



Lamination



Prepreg Layup



Prepreg Layup



Black Oxide Treatment



Black Oxide Treatment



D.F. Exposure / Developing



D.F. Exposure / Developing



Dry film, Exposure & DES



Dry film, Exposure & DES



Electro Plating



Electro Plating



Desmear / Electroless Copper Plating






Desmear / Electroless Copper Plating






Laser Drlling for Blind Via



Laser Drilling for Blind Via



D.F. Strip



D.F. Strip



Etching



Etching



D.F. Exposure / Developing
D.F. Exposure / Developing
S/M Exposure / Developing



S/M Exposure / Developing
S/M Exposure / Developing



Surface Finish



Surface Finish
Surface Finish



Symbol Mask Printing



Symbol Mask Printing
Symbol Mask Printing



Inspection