HDI Technology in Hole
HDI Technology in Hole
High Density Interconnection
High Density Interconnection
Blind & Burried 9+2+9 Laser Drill
Blind & Burried 9+2+9 Laser Drill
Market Trend vs. Technology Solution
Market Trend vs. Technology Solution
HDI Process Flow
HDI Process Flow
Main Process of Build - up Layer
Main Process of Build – up Layer
Construction Materials
Construction Materials
Material Type
Material Type
- FR 4 Tetra Function ( Tg. 130 – 140 ℃ )
- FR 4 High Tg ( Tg. 160 – 180 ℃ )
- RCC ( Tg. 150 ℃ & Tg. 185 ℃ )
- Ink ( VIL )
Comparison of Material
Comparison of Material
| Prepreg | RCC | |
| Low Cost | ++ | - |
| Strength | ++ | + |
| Hole wall roughness | - | + |
| Laminating control | + | - |
| Dielectric thickness | 45um ~ | 30um ~ 80um |
| Smear residue on target pad | - | ++ |
| Dielectric constant | 3.9 ~ 4.7 | 3.2 ~ 3.8 |
| Shelf time | ++ | + |
| Working PNL size | ++ | + |
Comparison of Via Technologies
Comparison of Via Technologies
| Mechanical Drilling | Laser Drilling | |
| Low Cost in Equipment | ++ | + |
| Low Cost in Production | + | ++ |
| Required Facilities | Drilling Machine | Laser Machine |
| Consumable | Drill Bits, Backup Board | None |
| Aspect Ratio | 9 | 1 |
| Via Size Capacity | 200 um~ | 50~100um |
| Speed | 140 H/min | 20,000 H/min |
| Throughput | - | + |
Comparison of Blind Via
Comparison of Blind Via
Prepreg
Prepreg
RCC
RCC
Build-up for 2 + N + 2
Build-up for 2 + N + 2
Through Hole
Through Hole
Inner Laser Via
Inner Laser Via
Stack Hole
Stack Hole
Inner Via Hole
Inner Via Hole
Surface Laser Via
Surface Laser Via
Laser Via Quality
Laser Via Quality
Laser Via Quality
1+6+1 without buried, extend to 1+N+1
1+6+1 without buried, extend to 1+N+1
1+4+4+1 with buried via, extend to 1+N+N+1
1+4+4+1 with buried via, extend to 1+N+N+1
1+4+4+1 with buried via, extend to 1+N+N+1
Black Oxide Treatment
Black Oxide Treatment
D.F. Strip
D.F. Strip
Etching
D.F. Exposure / Developing
D.F. Exposure / Developing
Dry Film Lamination
Dry Film Lamination
I.V.H.Grinding( for thickness >= 60 mil )
I.V.H.Grinding
( for thickness >= 60 mil )
( for thickness >= 60 mil )
I.V.H.Grinding( for thickness >= 60 mil )
Inner Via Hole Plugging
( for thickness >= 60 mil )
( for thickness >= 60 mil )
Electro Plating
Electro Plating
Electroless Copper Plating
Electroless Copper Plating
I.V.H.(Inner Via Hole) Drilling
I.V.H.(Inner Via Hole) Drilling
I.V.H.(Inner Via Hole) Drilling
I.V.H.(Inner Via Hole) Drilling
Blind via Capability
Blind via Capability
2+4+2 Staggered via, extend to 2+N+2
2+4+2 Staggered via, extend to 2+N+2
2+4+2 Staggered via, extend to 2+N+2
2+4+2 Staggered via, extend to 2+N+2
2+4+2 laser via on laser via
2+4+2 laser via on laser via
Solder Mask Printing
Dry Film Lamination
Dry Film Lamination
Lamination
Lamination
Prepreg Layup
Prepreg Layup
Black Oxide Treatment
Black Oxide Treatment
D.F. Exposure / Developing
D.F. Exposure / Developing
Dry film, Exposure & DES
Dry film, Exposure & DES
Electro Plating
Electro Plating
Desmear / Electroless Copper Plating
Desmear / Electroless Copper Plating
Laser Drlling for Blind Via
Laser Drilling for Blind Via
D.F. Strip
D.F. Strip
Etching
Etching
D.F. Exposure / Developing
D.F. Exposure / Developing
S/M Exposure / Developing
S/M Exposure / Developing
S/M Exposure / Developing
Surface Finish
Surface Finish
Surface Finish
Symbol Mask Printing
Symbol Mask Printing
Symbol Mask Printing
Inspection