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HDI Technology in Hole

HDI Technology in Hole

hdi-capability1
High Density Interconnection

High Density Interconnection

Blind & Burried 9+2+9 Laser Drill

Blind & Burried 9+2+9 Laser Drill

Market Trend vs. Technology Solution

Market Trend vs. Technology Solution

HDI Process Flow

HDI Process Flow

Main Process of Build - up Layer

Main Process of Build – up Layer

Construction Materials

Construction Materials

Material Type

  • FR 4 Tetra Function ( Tg. 130 – 140 ℃ )
  • FR 4 High Tg ( Tg. 160 – 180 ℃ )
  • RCC ( Tg. 150 ℃ & Tg. 185 ℃ )
  • Ink ( VIL )
Comparison of Material

Comparison of Material

Comparison of Via Technologies

Comparison of Via Technologies

Comparison of Blind Via

Comparison of Blind Via

Prepreg

RCC

Build-up for 2 + N + 2

Build-up for 2 + N + 2

Through Hole

Inner Laser Via

Stack Hole

Inner Via Hole

Surface Laser Via

Laser Via Quality

Laser Via Quality

1+6+1 without buried, extend to 1+N+1

1+6+1 without buried, extend to 1+N+1

1+4+4+1 with buried via, extend to 1+N+N+1

1+4+4+1 with buried via, extend to 1+N+N+1

2+4+2 laser via on laser via

2+4+2 laser via on laser via

2+4+2 Staggered via, extend to 2+N+2

2+4+2 Staggered via, extend to 2+N+2

Blind via Capability

Blind via Capability

4- Layer Core Receiving

4- Layer Core Receiving

I.V.H.(Inner Via Hole) Drilling

I.V.H.(Inner Via Hole) Drilling

Electroless Copper Plating

Electroless Copper Plating

Electro Plating

Electro Plating

Inner Via Hole Plugging ( for thickness >= 60 mil )

Inner Via Hole Plugging
( for thickness >= 60 mil )

I.V.H.Grinding ( for thickness >= 60 mil )

I.V.H.Grinding
( for thickness >= 60 mil )

Dry Film Lamination

Dry Film Lamination

D.F. Exposure / Developing

D.F. Exposure / Developing

Etching

Etching

D.F. Strip

D.F. Strip

Black Oxide Treatment

Black Oxide Treatment

Prepreg Layup

Prepreg Layup

Lamination

Lamination

Dry Film Lamination

Dry Film Lamination

D.F. Exposure / Developing

D.F. Exposure / Developing

Etching

Etching

D.F. Strip

D.F. Strip

Mechanical Drlling for TH

Mechanical Drlling for TH

Laser Drlling for Blind Via

Laser Drlling for Blind Via

Desmear / Electroless Copper Plating

Desmear / Electroless Copper Plating

Electro Plating

Electro Plating

Dry film, Exposure & DES

Dry film, Exposure & DES

Solder Mask Printing

Solder Mask Printing

S/M Exposure / Developing

S/M Exposure / Developing

Surface Finish

Surface Finish

Symbol Mask Printing

Symbol Mask Printing

Inspection

Inspection