Telecommunication PCB

The fastest and major technological advancements in decades have been in the telecommunication industry. The telecommunications sector is continuously evolving even now. This is due to markets demanding faster, more reliable, and more efficient communication systems. The foundation of such systems is built on PCBs or printed circuit boards. These boards typically enable modern telecommunication systems to operate with their complex functionality.

We, at Rush PCB Inc., fabricate and assemble all types of PCBs for the telecommunications industry. Not only do our PCBs have unique characteristics, but we also offer our customers several benefits. Our telecommunications PCBs play a critical role in shaping our connected world.

Importance of PCBs in Telecommunications Equipment

For any type of equipment in the telecommunications sector, the PCB inside it serves as its foundation. It mainly serves two functions. First, the PCB Is a structural support for the numerous electronic components. Second, the board connects these components electrically. Both functions are highly significant as the equipment can function as intended. In the context of telecommunication equipment, PCBs are primarily useful for:

• Power distribution
• Signal processing and transmission
• Data switching and routing
• Frequency modulation and demodulation
• Analog-to-digital and digital-to-analog conversion
• Amplification and filtering of signals

Mandatory Features for Telecommunication PCB

Telecommunication PCBs must meet the unique demands of the industry. Due to the nature of their applications, the PCBs must exhibit these features:

• Signal Integrity
• High-frequency performance
• Thermal management
• Electromagnetic compatibility
• Reliability and durability
• Cost-effectiveness
• Miniaturization

Types of Telecommunication PCBs from Rush PCB Inc.

Rush PCB Inc. manufactures and assembles a large variety of PCBs for the telecommunications sector. We design each PCB to meet the specific requirements of different applications. The main types of PCBs we offer to the telecommunications sector are:

• Multilayer PCBs: This type of PCB is the workhorse of the telecommunications industry. Its construction involves multiple rigid substrates alternating with conductive copper layers. We select the substrates carefully to provide excellent signal integrity at high frequencies. Multiple layers offer high flexibility in routing and high component density. This leads to a cost-effective and compact PCB.
  We typically offer 4-16-layer boards depending on the requirement and the application. However, for complex applications, we can go up to 50+ layers. We manufacture multilayer PCBs with complex routing of power and signal lines.

• Flexible PCBs: For telecommunications equipment with limited space, we offer flexible PCBs. As these boards can flex, fold, and bend, they offer the unique advantage of three-dimensional design solutions.
• Rigid-Flex PCBs: In some telecommunications equipment we can combine the benefits of both rigid and flexible boards. For this, we offer a versatile solution of rigid-flex PCBs for complex telecommunication equipment. Here, we offer rigid boards interlinked with flexible PCBs. This way, we eliminate the use of connectors, wire harnesses, and cables.
• High-Density Interconnect PCBs: Complex telecommunications equipment often requires very high component density. This is specifically necessary for portable and compact telecommunications devices. To meet such demands, we offer HDI or high-density interconnect PCBs.
  HDI PCBs are primarily multilayer boards but with fine traces closely spaced. We increase the routing density by using blind/buried vias, and microvias. We also use advanced layout techniques such as via-in-pads to increase the routing density further. For highly compact applications, we use miniature surface mount components like µBGAs. We also integrate passive devices into the PCB to further reduce the form factor of the board.

• Metal Core PCBs: The telecommunications industry mainly uses our metal core PCBs in applications requiring good thermal management. Here, the PCB comes with a metal core attached to it. A thin insulating material layer separates them. The insulating layer has very high thermal conductivity. The insulating layer transfers heat from the board into the metal core.
• Heavy Copper PCBs: Most telecommunication equipment requires highly stable power supplies. To supply the high currents required by such equipment, we make our PCBs with copper traces thicker than what the regular boards use. This also reduces the volume resistance of the copper trace as well as the voltage drop across it. This in turn enhances the stability of the power supply circuit to the load.

Challenging Environments Faced by Telecommunication PCB

Telecommunication PCBs from Rush PCB Inc. must face many challenging environments depending on their working conditions. Some such challenges are:

Mobile Communication Devices: Mobile phones and tablets are the most common telecommunication devices. PCBs in these devices must balance extreme miniaturization with high functionality. Typically, these PCBs must be:

• Flexible or rigid-flex design
• Multilayered with HDI technology
• Capable of handling high frequencies
• Capable of good thermal management in compact design
• Capable of managing EMI/EMC
• Capable of balancing performance with battery power

Networking Infrastructure and Base Stations: Networking infrastructure and base station equipment are the backbone of many telecommunication systems. PCBs in these devices must maintain high signal integrity while handling high power. Typically, these PCBs must be:

• Multilayer boards with a higher layer count
• High-efficiency power distribution with heavy copper
• Low-loss material for good high-frequency signal transmission
• Capable of good thermal management
• Capable of maintaining high signal integrity
• Highly reliable in outdoor environments

Satellite Communication Systems: Satellite communication systems need to function as expected despite the conditions existing in space.  PCBs in these systems must maintain signal integrity even in the harshest climates. Essentially, these PCBs must be:

• Highly reliable (Polyimide)
• Radiation hardened
• Precision impedance
• Capable of good thermal management
• Capable of working even with wide temperature fluctuations
• Capable of withstanding shock and vibration during launch
• Capable of reliable operations throughout the long life of the satellite

Optical Networking Devices: Optical networking is now an essential part of telecommunications with increasing data rates. PCBs in these devices must effectively interface between optical and electronic circuits. Essentially, these PCBs must be:

• Capable of processing digital signals at high speeds
• Equipped with special areas for mounting optical components
• Precision impedance control for handling high-speed signals
• Capable of minimizing signal degradation with low-loss materials
• Capable of managing the transition between optical and electrical signals
• Capable of good thermal management

IoT Devices: IoT or the Internet of Things is expanding rapidly with innumerable connected devices. PCBs in these devices must balance high functionality with energy efficiency and cost-effectiveness. Typically, these PCBs must be:

• Compact, flexible HDI PCBs
• Capable of low power consumption and extended battery life
• Capable of integrating high-frequency wireless communication modules
• Capable of interfacing with sensors to collect data
• Highly reliable in adverse operating conditions
• Capable of balancing cost constraints and functionality

Materials We Use for Telecommunication PCB

The proper selection of the materials used in telecommunication PCB is a pivotal step to its functionality. We must choose suitably:

• Substrate laminates
• Prepregs
• Conductive layers
• Soldermask 
• Surface finish
• Encapsulation

Choosing the above is important to meet various specifications. The environmental, mechanical, and electrical requirements of the application determine these. Materials that we use for telecommunication PCBs are:

• FR-4: This is a standard PCB substrate, consisting of glass-reinforced epoxy. FR-4 is readily available and has reliable mechanical strength and high electrical insulation. It is also resilient to most environmental conditions. We source FR-4 material to meet IPC standards and other rigorous quality control requirements.
• High-Frequency Laminates: For equipment operating above 1 GHz, we essentially use low-loss laminates for our PCBs. We use many low-loss laminates for high-frequency operation. These include TFLY and TLY laminates of the Taconic family, Isola, RT/droid series, and RO3000 and RO4000 of the Rogers family of laminates. We achieve optimal impedance matching by carefully selecting materials based on loss tangent and dielectric constant. This ensures all our PCBs maintain signal integrity at their operating data rates and frequencies. We thoroughly test these materials to confirm their modeled electrical performance.
• PTFE-Based Composites: Telecommunication equipment operating at microwave frequencies requires extreme stability and tolerance. For such equipment, we use PCBs made of ceramic-filled PTFE substrates. Chief among them is Rogers RT/Duroid 6202PR. This material can also resist severe corrosive environments together with thermal shocks as in avionic applications. It has a dimensionally stable PTFE matrix and a low Dk ceramic filter. These are critical for high-frequency front-end modules.

Why Rush PCB Inc. for Telecommunication PCB

For telecommunication PCBs, we follow enhanced manufacturing techniques including strict adherence to industry standards. For precise component placement, we use automated machinery. We do thorough testing and inspections to ensure we fully meet the necessary standards and requirements. For this, we use:

• AOI or Automated Optical Inspection
• Solderability tests
• Ionic contamination testing
• Peel strength tests
• XRF or X-ray Fluorescence
• FAI or First Article Inspection
• Micro-Section Analysis
• Flying probe test after assembly
• TDR or Time Domain Reflectometry

In addition, we deliver telecommunication PCBs according to the IPC-6012 standard for qualification and acceptance of rigid printed circuit boards for Classes 2 and 3. We offer full traceability while meeting your high-reliability requirements. We also meet requirements ensuring delivery of zero-defect boards by conforming to:

• UL 94VO0: Safety of flammability of Plastic materials
• IPC-A-610H: Soldering standards for telecommunications PCBs

Finally

Contact us today for your telecommunications PCB requirements. Send us your Gerber/ODB++/IPC-2581 files securely through our website. We will analyze your board according to DFM/DFA requirements and send you a report. Send us your BOM, quantity required, and turn time. We will send you a reasonable quote for your project.