Flex Capability
Flex capability, Material selection, process tolerances, manufacturing logistics, and your flex supplier all play an important role in producing a cost-effective and reliable flex circuit design.
At Rushpcb will assist you in design for pcb manufacturing to minimize overall program costs. Listed are standard materials and capabilities.
Come speak with us should your design require tighter tolerances or special process treatments.
Manufacturing of flex capabilities
In pcb manufacturing of flex capability, PCB Company creates bare boards. For the past ten years and more, this has been the core of our business or flex capability.
In flex capability pcb, Whether you need a few custom PCB assembly boards fast, or many boards for your production schedule; whether you require simple breakout/pinout boards, or highly complex Microwave/RF boards, PCB supplier has a service for your needs.
| Polyimide Thickness | 0.0005″ (12 um), 0.001″ (25 um), 0.002″(50 um), 0.003″ (75 um), 0.005″ (125 um) |
| Copper (thickness) | 0.25 oz.(9 um), 0.33 oz.(12 um), 0.5 oz. (17 um), 1 oz.(35 um), 2 oz.(70 um) |
| Copper Foils(rolled-annealed) | Polyimide, Polyester, LPI (liquid photo imageable), PIC(photo imageable cover coat) |
| Stiffeners | FR-4, Polyimide, Metal, or customer supplied |
| Thermo-bond Adhesives | Acrylic, Phenolic Butyral, Modified Epoxy |
| Surface Finishes | Solder (hot air leveling or tin/lead plating), Electrolytic Soft Bondable Gold, Hard Gold, ENIG (electroless nickel immersion gold), Entek 106A, & Immersion Tin |
| Minimum Trace/Space | 0.0015″/.002″ (0.33 oz.) 0.002″/.0025″ (0.5 oz.) 0.003″/.0035″ (1 oz.) |
| Minimum Via Hole Diameter (before plating) | 0.006″ (NC Drill) 0.002″ (UV Laser) |
| Minimum Blind Via Diameter (before plating) | 0.004″ (UV Laser) |
| Trace to Edge Distance | 0.010″ ( NC Route ) 0.008″ (Die Punch) 0.001″ (UV Laser)* |
| Trace to Edge Tolerance | 0.005″ ( NC Route ) 0.003″ (Die Punch) 0.001″ (UV Laser) |
| Cover Layer Aperture Positional Tolerance | 0.005″ (Cover Film) 0.002″ (LPI and PIC) 0.001″ (Laser Ablation)** |
* Trace to edge distance should be greater than 0.003″ for proper copper insulation
** Laser defined apertures created by ablating cover layer material
