| Manufacturing Capabilities – Technology of Rush PCB | |||
| Standard | Advanced | Emerging | |
| Layer Count | 2-48 Layers | 2-48 Layers | 50+ Layers |
| Laminate Materials | |||
| FR4 Tg 140 | Yes | Yes | Yes |
| FR4 Tg 170 | Yes | Yes | Yes |
| FR4 Tg 180 | Yes | Yes | Yes |
| GETEK | Yes | Yes | Yes |
| Polyimide | Yes | Yes | Yes |
| Rogers RF | Yes | Yes | Yes |
| Taconic RF | Yes | Yes | Yes |
| Arlon RF | Yes | Yes | Yes |
| Duriod | Yes | Yes | Yes |
| RoHS Materials | Yes | Yes | Yes |
| Halogen Free | Yes | Yes | Yes |
| Aluminum Backing | Yes | Yes | Yes |
| Brass Backing | Yes | Yes | Yes |
| Copper Backing | Yes | Yes | Yes |
| Bergquist | Yes | Yes | Yes |
| Laird | Yes | Yes | Yes |
| C-LEC Plastic | Yes | Yes | Yes |
| Speed Board | Yes | Yes | Yes |
| Flex Substrates | Yes | Yes | Yes |
| Board Types | |||
| Rigid | yes | yes | yes |
| Rigid-Flex | yes | yes | yes |
| Flex | yes | yes | yes |
| RF Microwave | yes | yes | yes |
| Mix Dielectrics / Hybrid Material | yes | yes | yes |
| Dielectrics With Metal Core/Backing | yes | yes | yes |
| Panel Sizes | Standard Panel | Non-Standard Panel | |
| 12 X 18 | Yes | No | |
| 16 X 18 | Yes | No | |
| 16 x 21 | No | Yes | |
| 18 X 24 | Yes | No | |
| 21 x 24 | No | Yes | |
| 22 x 28 | No | Yes | |
| 47″ x 47″ (maximum working panel 2 layers) | No | Yes | |
| 39″ x 39″ (maximum working panel 4-8 layers) | No | Yes | |
| 27″ x 27″ (maximum working panel 10 layers) | No | Yes | |
| ** Panel Utilization Can Vary On Panel Area Depending On Design, IPC Coupons & TDR Coupons. | |||
| Board Types | |||
| Finish Thickness | .003″ to .200″ | .003″ to .500″ | > .500 |
| Minimum Core Thickness | .004″ | .003″ | .002″ |
| Finished Thickness Tolerance | 10% | 7% | 5% |
| Multiple Lamination Cycles | 5 | 7 | 7+ |
| Copper Foil Weights (Internal Layers) | 1/2 – 3 OZ | 1/4 – 4 OZ | 1/4 – 6 OZ |
| Copper Foil Weights (External Layers) | 1/2 – 3 OZ | 1/4 – 4 OZ | 1/4 – 6 OZ |
| Pad, Lines & Spacing Diameters | |||
| External Line Width | .004″ | .003″ | .002″ |
| External Spacing | .004″ | .003″ | .002″ |
| Internal Line Width | .004″ | .003″ | .002″ |
| Internal Spacing | .004″ | .003″ | .002″ |
| External Pad Size – Annual Ring Per Side | .005″ | .004″ | .003″ |
| Internal Pad Size – Annular Ring Per Side | .005″ | .004″ | .003″ |
| SMT Pitch | .040″ | .030″ | .020″ |
| BGA Pitch | 0.40 mm | 0.30 mm | 0.2 mm |
| Impedance | 10% | 5% | 2.50% |
| Plating Finishes | |||
| ENIG (Electroless Nickel Immersion Gold) | Yes | Yes | Yes |
| Immersion Silver | Yes | Yes | Yes |
| Immersion White Tin | Yes | Yes | Yes |
| HASL (60/40 Tin-Lead) | Yes | Yes | Yes |
| HAL (Lead-Free) | Yes | Yes | Yes |
| Nickel (Electroplated) | Yes | Yes | Yes |
| Palladium (Electroplated) | Yes | Yes | Yes |
| Gold (Electroplated) | Yes | Yes | Yes |
| Soft Wire Bondable Gold | Yes | Yes | Yes |
| OSP (Organic Surface Protection) | Yes | Yes | Yes |
| Carbon Ink | Yes | Yes | Yes |
| Selective Plating | Yes | Yes | Yes |
| RoHS Finishes | |||
| ENIG (Electroless Nickel Immersion Gold) | Yes | Yes | Yes |
| Immersion Silver | Yes | Yes | Yes |
| Immersion White Tin | Yes | Yes | Yes |
| HAL (Lead-Free) | Yes | Yes | Yes |
| OSP (Organic Surface Protection) | Yes | Yes | Yes |
| Soft Wire Bondable Gold | Yes | Yes | Yes |
| Tolerances | |||
| Hole Aspect Ratio | 10:01 | 15:01 | 20:01 |
| Drilled Hole To Copper | .008″ | .005″ | < .005″ |
| Plated Hole Tolerances (+/-) | .003″ | .002″ | <.002″ |
| Non Plated Hole Tolerances (+/-) | .001″ | .001″ | .001″ |
| Fabrication Tolerances (+/-) | .005″ | .003″ | <.003″ |
| Board thickness Tolerance(+/-) | 10% | ||
| Via Holes | |||
| Laser Micro Vias | 0.004 * | 0.003 * | 0.002 * |
| Blind Vias | .0063″ | .0063″ | .0063″ |
| Buried Vias | .0063″ | .0063″ | .0063″ |
| Via Holes Under PAD | Yes | Yes | Yes |
| Laser Drill | Pending | Pending | Pending |
| Mechanical Drill Vias | .0063″ | .0063″ | .0063″ |
| Tented Vias | Coated with LPI | Coated/Plugged | Coated/Plugged |
| Silver Conductive Via Filled | Yes | Yes | Yes |
| Copper Conductive Via Filled | Yes | Yes | Yes |
| Non-Conductive Via Filled | Yes | Yes | Yes |
| Copper Plated Plugged Vias (80%) .008″ Min | Yes | Yes | Yes |
| Automated Planarization Capability | Yes | Yes | Yes |
| Routing/Scoring | |||
| Scoring (Jump) | Yes | Yes | Yes |
| Scoring (Jump) Min length 1″ | Yes | Yes | Yes |
| Scoring Webb .014 +/- .003 Min | Yes | Yes | Yes |
| Routed/Plated Edges | Yes | Yes | Yes |
| Routed/Plated Pockets & Cuts Outs | Yes | Yes | Yes |
| Z-Depth Routing (Plated Pockets & Cutouts) | Yes | Yes | Yes |
| Cavities (Plated & Non-Plated) | Yes | Yes | Yes |
| Soldermask | |||
| LPI (Liquid Photo Imagable Soldermask) | Yes | Yes | Yes |
| Soldermask Colors | All Avail. Colors | All Avail.Colors | All Avail.Colors |
| Soldermask Type | LPI | LPI | LPI |
| Dry Film Soldermask | Yes | Yes | Yes |
| Minimum Mask Clearance (LPI) Per Side | .003″ | .002″ | .001″ |
| Minimum Mask Clearance (Dry Film) | .003″ | .003″ | .003″ |
| Minimum Soldermask Thickness (LPI) | .0005″ | .0004″ | .0004″ |
| Minimum Soldermask Thickness (Dry Film) | .003″ | .003″ | .003″ |
| Soldermask Web Minimum (LPI) | .004″ | .003″ | .003″ |
| Soldermask Web Minimum (Dry Film) | .010″ | .008″ | .008″ |
| Silkscreen/Legend | |||
| Silkscreen/Legend Colors | All Avail. Colors | All Avail. Colors | All Avail. Colors |
| Silkscreen/Legend Feature Size | .008″ W X .030 H Min. | .008″ W X .030 H Min. | .008″ W X .030 H Min. |
| Flatness | IPS Standard | IPC Standard | IPC Standard |
| Electrical Testing | |||
| Netlist Testing | Yes | Yes | Yes |
| Flying Probe | Yes | Yes | Yes |
| Clamshell Fixture | Yes | Yes | Yes |
| Netlist IPC-356A | Yes | Yes | Yes |
| Controlled Impedance | |||
| Controlled Impedance Testing | Yes | Yes | Yes |
| TDR Tester (Polar Instruments) | Yes | Yes | Yes |
| Impedance tolerance (+/-) | 10% | 5% | 2.50% |
| CAM | |||
| Genesis 2000 | Yes | Yes | Yes |
| ODB++ | Yes | Yes | Yes |
| FTP Site | Yes | Yes | Yes |
| Certifications & Standards | |||
| AS9100 Certified | Yes | Yes | Yes |
| ISO 9001:2008 Certified | Yes | Yes | Yes |
| MIL-PRF-31032 Certified | Pending late 2011 | Pending late 2011 | Pendind late 2011 |
| ITAR Registered | Yes | Yes | Yes |
| IPC Standards | Yes | Yes | Yes |
| IPC-6012 Class 1,2,& 3 | Yes | Yes | Yes |
| IPC-6013 Class 1,2,& 3 | Yes | Yes | Yes |
| IPC-6018 Class 1,2 & 3 | Yes | Yes | Yes |
| MIL-PRF-55110 Certified FR4/GFN | Yes | Yes | Yes |
| MIL-PRF-55110 Certified Polyimide/GIN | Yes | Yes | Yes |
| Certified Etchback On Mil-PRF-55110 | Yes | Yes | Yes |
Manufacturing Capabilities
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