| Finish | Description |
| HASL (Hot Air Solder Leveled) | Solder is deposited on features that are not covered with solder mask. Solder Thickness varies from 0.2 to 1.2 mils. This variation is due to board circuit density and aspect ratio. Solder consists of 63%/37% eutectic Tin/Lead |
| OSP (Organic Solderability Preservative) | A transparent organic coating is deposited on features that are not covered with solder mask. |
| ENIG (Electroless nickel/gold) | Electroless nickel and electroless gold are deposited on features that are not covered with solder mask. Thickness for nickel is between 80 and 150 microinches, and Gold thickness is 3-6 microinches and gold thickness. |
| Gold Flash | Electrolytic nickel-gold is deposited on solderable features. Typically, 150-200 microinches of nickel is deposited, and 5-10 microinches of hard gold. Gold flash is applied to features after pattern copper plating. |
| Immersion Silver | Silver is deposited on features not covered with solder mask. Thickness of silver is 4 to 20 microinches. |
| White Tin | Immersion tin is deposited on features not covered with solder mask. Thickness is typically 30-40 microinches. |
| Carbon Ink for Keypad application | A conductive carbon paste is applied on selective pads for contact purposes, e.g.. keypads of calculators, etc. |
| Wire Bondable Soft Gold | Electrolytic soft gold is plated on features that require bondable gold for wire bonding applications. Depending on the type of wire bonding used, the thickness of gold varies from 20 to 50 microinches. nickel thickness is between 150 and 250 microinches. |
Surface Finish
Template: desktop two
