Flex + Rigid Hybrid Board

FR4 & Polyimide Kapton Thick

flex_rigid-flex-1

Flexible Board

FR4 & Polyimide Kapton Thick

Blind & Burried 1+FLEX+1 Laser drill

Material:

  • Flex:L2~L3 TU-768:L1~L0 L0~L4
  • Laser:L4~L0 laser via:0.006″
  • Dielec tricthickness: 0.0035″~0.0045″
  •  No VIPPO

Construction Materials

Material Type

  • PI thic:1~3mils
  • Coverlay thic:2mils
  • Ink thic:0.5~0.9mils
  • Adhesive thic:1~2mils (Polyester)
  • Nonflow PP 47N 49N thic:2.5mils
  • Stiffener PI FR4 AL
  • Copper ED RA
  • EMI SF-PC5500 thic:0.6~0.8mils
  • Cu + adhesive thic:2.4mils

Blind vias

  • Copper windowing
  • Laser via
  • Copper plating
  • Coverlay/Soldermask
  • Fab.: CNC, Laser cutting
  • Stiffener

Flex Main Equipments

Precision hot-Air Oven

LDI

Laser cutting

Mass. Lam. For flex and cover lay

Material Aluminum & FLEX base

Material:

  • FR4-ISOLA370HR Aluminium flex

Capability