What about moisture sensitive components?

Over time, many SMT component packages absorb small amounts of moisture. When these components go through the reflow oven, this moisture may expand, damaging or destroying the component. Sometimes the damage can be seen visually; sometimes it can’t be seen at all.

Baking will dry this damaging moisture out of the components. If we need to bake your components, your job may be delayed up to 48 hours. The bake time will not count toward your turn-time.
• We follow the JDEC J-STD-033B.1 standard.

What that means is if the component is labeled as moisture sensitive, or is opened and unlabeled, we will either determine if it needs to be baked or call you for this determination.

On 5 and 10 day turn-times, this probably will not cause delays. On 24 and 48 hour jobs, the need to bake components will cause a delay of up to 48 hours. The extra time for baking will be added to your turn-time.

If possible, always send us your components sealed in the original packaging, as you received them.