A final finish, which was already introduced more than ten years ago, is now receiving renewed attention because of its suitability for both Pb-free soldering and wire bonding applications, namely Electroless Nickel / Electroless Palladium / Immersion Gold (ENEPIG). Brittle fracture on BGAs is also no issue with this combination of metallic layers.
PCB Fabrication :Electroless Nickel / Electroless Palladium / Immersion Gold (ENEPIG)
Published on February 12, 2014
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