| Manufacturer | Rush PCB Inc. |
| Layer | FPC 2L |
| Kit Size | 219*175 |
| PNL Size | |
| Unit per m2 | |
| Surface Treatment | ENIG |
| Gold Plating Thickness | Au Min 0.03mh NI : 3~5mh |
| Base | 1/2mil(13um) 1/4oz |
| Drill Size | 0.1Æ |
| PSR | SPI-606G YELLOW |
| Application | Smart Card |
| Coverlay | 1/2mil (13um) |
| PrePreg | |
| Final Thickness | 0.09T |
| Remarks | VIA FILL Plating |
RushPcb Inc. specializes in higher layer count PCBs, exotic materials, laser drill micro-vias, blind/buried vias, as well as conductive and non-conductive via fill.
