Capabilities: Flex Circuits

Material selection, process tolerances, manufacturing logistics, and your flex supplier all play an important role in producing a cost-effective and reliable flex circuit design.

At RUSH PCB, we can assist you in your Design For Manufacturing (DFM) efforts to help minimize overall program costs. Listed are standard materials and capabilities .

Come speak with us should your design require tighter tolerances or special process treatments.

 Material Selection

Polyimide Thickness

0.0005" (12 um), 0.001" (25 um), 0.002"
(50 um), 0.003" (75 um), 0.005" (125 um)

Copper (thickness)

0.25 oz.(9 um),  0.33 oz.(12 um), 0.5 oz. (17 um),  1 oz.(35 um),  2 oz.(70 um)

Copper Foils

Polyimide, Polyester, LPI (liquid photo imageable), PIC(photo imageable cover coat) 


FR-4, Polyimide, Metal, or customer supplied

Thermo-bond Adhesives

Acrylic, Phenolic Butyral, Modified Epoxy

Surface Finishes

Solder (hot air leveling or tin/lead plating), Electrolytic Soft Bondable Gold, Hard Gold, ENIG (electroless nickel immersion gold), Entek 106A, & Immersion Tin

 Process Capabilities and Tolerances

Minimum Trace/Space 

0.0015"/.002" (0.33 oz.)
0.002"/.0025" (0.5 oz.)
0.003"/.0035" (1 oz.)

Minimum Via Hole Diameter (before plating)

0.006" (NC Drill)
0.002" (UV Laser)

Minimum Blind Via Diameter (before plating)

0.004" (UV Laser)

Trace to Edge Distance

0.010" ( NC Route ) 
0.008" (Die Punch)
0.001" (UV Laser)*

Trace to Edge Tolerance

0.005" ( NC Route ) 
0.003" (Die Punch)
0.001" (UV Laser)

Cover Layer Aperture Positional Tolerance

0.005" (Cover Film) 
0.002" (LPI and PIC)
0.001" (Laser Ablation)**

* Trace to edge distance should be greater than 0.003" for proper copper insulation
** Laser defined apertures created by ablating cover layer material
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