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New High-Density, Direct Connection for PCB’s

Written by Admin on . Posted in PCB Design, PCB Manufacturing

A new high-density direct connection for printed circuit boards has been placed on the market by Phoenix Contact.  Dubbed the SDDC 1.5 connection system it offers four to thirty-two conductors using “SKEDD” plug-ins.  Using the SDDC 1.5 eliminates the need for a header and soldering during the manufacturing process, saving money.   Using a push-in spring connection allows wires to be terminated to the connector.  It has also been designed with solid, stranded wires that include a ferrule which can be pushed into the terminal block while the spring clamp stays closed.  Removing the wires is simple by pressing the orange spring lever with a regular screwdriver.  It has a range of 3.5-mm centerline and works with 24 to 16 AWG wires, can handle currents up to 8 A at 300 V UL, and provides the push-in spring connection.  Its double row design is the latest in SKEDD Technology that uses a gas-tight connection.

The SDDC 1.5 connection system’s contact zone consists of two flexible parts that allow contacts to be easily adjusted with the use of plated through-holes on the printed circuit board.  The good news for manufacturer’s is that the design is so easy, it will not add to the cost of manufacturing, in fact, it can save on the production costs.  When inserted there is enough force that will create a gas-tight connection, requiring nothing special for the PCB.  The connection stability of the board is achieved by locking pins that expand with the push of the orange locking tabs.  It can potentially be used in building automation, HVAC systems, elevators and escalators, and white goods.

Also Read: View on PCB Design and Implementation today and in the future

Features include;

  • Allows you to save time during wire termination with its push-in connection
  • There is no need for a plug and header combination with its direct plug-in onto the PCB
  • Cost effective, only one component is necessary
  • Free positioning
  • Secure locking
  • Up to 25 mating and unmating cycles, for easy replacement
  • Intuitive use through color coded actuation lever
  • Quick and convenient testing using integrated test option

The SDDC 1.5 connection system is the newest high-density direct connection for printed circuit boards, that reduces manufacturing costs while allowing free positioning on the printed circuit board.  This is good news for the early adopters of this connection system, the implementation process does not require additional parts, the opposite is true, it only requires one component, does not require soldering and can be manufactured without using any tools.  Adding the integrated test option is simply another reason for considering the use of this connection system when necessary.

Also Read: Why it is Necessary to Control Humidity in PCB Assemblies

There is no doubt that the printed circuit board is the most important aspect of any technological project.  Meeting the industries demand for smaller, more effective, devices will continue to be a part of the PCB manufacturer’s responsibility.  The SDDC 1.5 connection system is an example of the latest in technological advances that we continue benefit from.  We look forward to the next advancement in PCB manufacturing!




Phoenix Contact


Essential Steps To Know About BGA

Written by Admin on . Posted in PCB, PCB Assembly and component, PCB Design, PCB Manufacturing

But although these 3d printed structures are cheap and easy to implement they can lack efficiency. They can be made complex, but for the moment complex 3d printed PCBs are difficult to produce in large volumes. Essential Steps to Know about BGA

When working with PCBs there can be many terms and acronyms that are confusing, and one such term is BGA. BGA, or Ball Grid Array, is a small package on a printed circuit board that is used to mount or hold microprocessors, completing integrated circuits. This article will provide 4 easy steps to get used to and understand BGAs.

Step 1: Benefits of using BGA

There are several different systems in place in order to mount devices in an integrated circuit. One of the earliest is the PGA, or Pin Grid Array, which had many pins to connect the circuit as opposed to pads, which the BGA system has. Although the PGA worked for several years, as technology advanced the pins were more and more compacted together and were not as efficient as BGA, which uses pads that conform to the circuit through solder, which is heated and then melted onto the board. BGA is also efficient when it comes to overheating, as it is able to release heat extremely well preventing the temperature of the circuit rising. This is due to lower thermal resistance of the mounting package. BGAs, because they are so close to the printed circuit board they reside on, have better electrical performance.

Step 2: Setbacks of the BGA

As with every piece of technology, there are some unfortunate disadvantages that the BGA has which you must understand if you are working with them. Luckily, the cons are not many, nor will they affect the circuit: it is still your job to prevent any problems as a result of these drawbacks. To begin with, BGAs are less flexible than previous iterations of grid arrays, meaning that bending or breakage may occur in a non-stabilized environment. Similarly, if you have a BGA under extreme conditions, such as extreme heat or extreme pressure, the solder on the BGA can fail to connect the components of the package. If you keep your BGAs in a stable system when manufacturing or working with them, then most of these problems will not affect you.
Step 3: Inspection

BGAs can be hard to inspect for issues when a circuit is no longer working, sometimes requiring X-ray inspection or a CT scanning machine to determine the cause of the problem with the circuit. Due to this, make sure you have the necessary equipment to work on the BGAs, and if you cannot afford to visually scan it, electrical techniques can also be useful, and physically inspecting the BGA is a cheap but dangerous method that can be used as well.
Step 4: Knowing the terminology

Although you are by now familiar with “BGA”, there are multiple other kinds of ball grid arrays that sound but are definitely not similar to BGAs, such as “CABGA”, which stands for Chip Array Ball Grid Array, and “MBGA”, which stands for Micro Ball Grid Array. A full list of variants on the BGA line of equipment can be found online, and we recommend that you check it out to fully familiarize yourself with all types of grid arrays.


View on PCB Design and Implementation today and in the future

Written by Admin on . Posted in PCB, PCB Design

PCBs are the cornerstone of just about all modern electronics, and they evolve along with the rest of the field. So what is the future of the PCB? The first things we’re likely to see is PCBs shrinking to meet the increasingly intense demand for thinner, lighter, and more powerful electronics. But these changes are just the tip of the iceberg. It’s also possible that we’ll see PCBs take a more active role in their devices. Currently they act as relays of a sort. They’re designed to carry electrical current, but what if they could take a more active role? As technology progresses we’re going to start even more seeing integrated logic and other components within PCBs themselves. This isn’t entirely new technology, but as implementation improves we’re going to see it making a huge difference in how devices function. It is vastly more efficient to have components integrated into the PCB because travel time for currents can be reduced, and even more importantly manufacturers will be able to cut down on wasted space within their designs. This technology is also going to allow for leaps in asynchronous processing which will allow for faster transfer speeds. Already we see transfer speeds on the order of several gigabits. We are rapidly approaching the point where PCB optimization is critical to creating good devices.
The Future lies in 3D printing
R&D will be critical but of course even the best technologies can fall by the wayside if they’re not economical enough or easy enough to manufacture. This is where emerging technologies like 3d printing will shine. We’ll see printers printing with conductive materials and manufacturing PCBs far more efficiently than would ever have been possible with more traditional laminated frameworks. 3d printers are now becoming capable of printing copper and other materials, and they can do so onto almost any materials. As a net effect this means that it will become far easier to implement cheap electronics into just about any household object. Printing PCBs with this method could cost as little as $50 for each meter of printed electronics. But although these 3d printed structures are cheap and easy to implement they can lack efficiency. They can be made complex, but for the moment complex 3d printed PCBs are difficult to produce in large volumes.
If you want to see the future of PCBs it is here already with Micro Electronic flex boards with 1 mil lines and spaces
Additionally, PCBs can be flexible, transparent, and durable. There flex and rigid flex PCBs as well three dimensional PCBs. There are also rolled flex boards that can be up to 30 feet long. There are also very sophisticated PCBs. Microvias for example, are used in a number of applications interconnecting the fused layers in PCBs and creating far denser circuits capable of accepting more complex components. This is just another innovation which will allow for smaller and more efficient PCBs. In summary. PCBs will continue get faster, smaller, and more efficient in the short term, but what is in store for us longer term? Here is a safe bet, things will get smaller and more complex. If you want to see what PCBs will look like in the future look at Micro Electronic Circuits such as the ones that go into very advanced hearing aids and in medical electronics such as a diagnostic capsule that you swallow and the boards that go into ultrasound wands. These are tiny flex boards with 1 mil lines and spaces. Now that’s the future.