Manufacturing Capabilities - Technology of Rush PCB
  Standard Advanced Emerging
Layer Count 2-48 Layers 2-48 Layers 50+ Layers
Laminate Materials      
FR4 Tg 140 Yes Yes Yes
FR4 Tg 170 Yes Yes Yes
FR4 Tg 180 Yes Yes Yes
GETEK Yes Yes Yes
Polyimide Yes Yes Yes
Rogers RF Yes Yes Yes
Taconic RF Yes Yes Yes
Arlon RF Yes Yes Yes
Duriod Yes Yes Yes
RoHS Materials Yes Yes Yes
Halogen Free Yes Yes Yes
Aluminum Backing Yes Yes Yes
Brass Backing Yes Yes Yes
Copper Backing Yes Yes Yes
Bergquist Yes Yes Yes
Laird Yes Yes Yes
C-LEC Plastic Yes Yes Yes
Speed Board Yes Yes Yes
Flex Substrates Yes Yes Yes
Board Types      
Rigid yes yes yes
Rigid-Flex yes yes yes
Flex yes yes yes
RF Microwave yes yes yes
Mix Dielectrics / Hybrid Material yes yes yes
Dielectrics With Metal Core/Backing yes yes yes
Panel Sizes Standard Panel Non-Standard Panel  
12 X 18 Yes No  
16 X 18 Yes No  
16 x 21 No Yes  
18 X 24 Yes No  
21 x 24 No Yes  
22 x 28 No Yes  
47" x 47" (maximum working panel 2 layers) No Yes  
39" x 39" (maximum working panel 4-8 layers) No Yes  
27" x 27" (maximum working panel 10 layers) No Yes  
** Panel Utilization Can Vary On Panel Area Depending On Design, IPC Coupons & TDR Coupons.
Board Types      
Finish Thickness .003" to .200" .003" to .500" > .500
Minimum Core Thickness .004" .003" .002"
Finished Thickness Tolerance 10% 7% 5%
Multiple Lamination Cycles 5 7 7+
Copper Foil Weights (Internal Layers) 1/2 - 3 OZ 1/4 - 4 OZ 1/4 - 6 OZ
Copper Foil Weights (External Layers) 1/2 - 3 OZ 1/4 - 4 OZ 1/4 - 6 OZ
Pad, Lines & Spacing Diameters      
External Line Width .004" .003" .002"
External Spacing .004" .003" .002"
Internal Line Width .004" .003" .002"
Internal Spacing .004" .003" .002"
External Pad Size - Annual Ring Per Side .005" .004" .003"
Internal Pad Size - Annular Ring Per Side .005" .004" .003"
SMT Pitch .040" .030" .020"
BGA Pitch .040" .030" .020"
Impedance 10% 5% 2.5%
Plating Finishes      
ENIG (Electroless Nickel Immersion Gold) Yes Yes Yes
Immersion Silver Yes Yes Yes
Immersion White Tin Yes Yes Yes
HASL (60/40 Tin-Lead) Yes Yes Yes
HAL (Lead-Free) Yes Yes Yes
Nickel (Electroplated) Yes Yes Yes
Palladium (Electroplated) Yes Yes Yes
Gold (Electroplated) Yes Yes Yes
Soft Wire Bondable Gold Yes Yes Yes
OSP (Organic Surface Protection) Yes Yes Yes
Carbon Ink Yes Yes Yes
Selective Plating Yes Yes Yes
RoHS Finishes      
ENIG (Electroless Nickel Immersion Gold) Yes Yes Yes
Immersion Silver Yes Yes Yes
Immersion White Tin Yes Yes Yes
HAL (Lead-Free) Yes Yes Yes
OSP (Organic Surface Protection) Yes Yes Yes
Soft Wire Bondable Gold Yes Yes Yes
Tolerances      
Hole Aspect Ratio 10:1 15:1 20:1
Drilled Hole To Copper .008" .005" < .005"
Plated Hole Tolerances (+/-) .003" .002" <.002"
Non Plated Hole Tolerances (+/-) .001" .001" .001"
Fabrication Tolerances (+/-) .005" .003" <.003"
Board thickness Tolerance(+/-) 10%
Via Holes      
Laser Micro Vias 0.004 * 0.003 * 0.002 *
Blind Vias .0063" .0063" .0063"
Buried Vias .0063" .0063" .0063"
Via Holes Under PAD Yes Yes Yes
Laser Drill Pending Pending Pending
Mechanical Drill Vias .0063" .0063" .0063"
Tented Vias Coated with LPI Coated/Plugged Coated/Plugged
Silver Conductive Via Filled Yes Yes Yes
Copper Conductive Via Filled Yes Yes Yes
Non-Conductive Via Filled Yes Yes Yes
Copper Plated Plugged Vias (80%) .008" Min Yes Yes Yes
Automated Planarization Capability Yes Yes Yes
Automated Planarization Capability * Laser Drilling outsourced
Routing/Scoring      
Scoring (Jump) Yes Yes Yes
Scoring (Jump) Min length 1" Yes Yes Yes
Scoring Webb .014 +/- .003 Min Yes Yes Yes
Routed/Plated Edges Yes Yes Yes
Routed/Plated Pockets & Cuts Outs Yes Yes Yes
Z-Depth Routing (Plated Pockets & Cutouts) Yes Yes Yes
Cavities (Plated & Non-Plated) Yes Yes Yes
Soldermask      
LPI (Liquid Photo Imagable Soldermask) Yes Yes Yes
Soldermask Colors All Avail. Colors All Avail.Colors All Avail.Colors
Soldermask Type LPI LPI LPI
Dry Film Soldermask Yes Yes Yes
Minimum Mask Clearance (LPI) Per Side .003" .002" .001"
Minimum Mask Clearance (Dry Film) .003" .003" .003"
Minimum Soldermask Thickness (LPI) .0005" .0004" .0004"
Minimum Soldermask Thickness (Dry Film) .003" .003" .003"
Soldermask Web Minimum (LPI) .004" .003" .003"
Soldermask Web Minimum (Dry Film) .010" .008" .008"
Silkscreen/Legend      
Silkscreen/Legend Colors All Avail. Colors All Avail. Colors All Avail. Colors
Silkscreen/Legend Feature Size .008" W X .030 H Min. .008" W X .030 H Min. .008" W X .030 H Min.
Flatness IPS Standard IPC Standard IPC Standard
Electrical Testing      
Netlist Testing Yes Yes Yes
Flying Probe Yes Yes Yes
Clamshell Fixture Yes Yes Yes
Netlist IPC-356A Yes Yes Yes
Controlled Impedance      
Controlled Impedance Testing Yes Yes Yes
TDR Tester (Polar Instruments) Yes Yes Yes
Impedance tolerance (+/-) 10% 5% 2.50%
CAM      
Genesis 2000 Yes Yes Yes
ODB++ Yes Yes Yes
FTP Site Yes Yes Yes
Certifications & Standards      
AS9100 Certified Yes Yes Yes
ISO 9001:2008 Certified Yes Yes Yes
MIL-PRF-31032 Certified Pending late 2011 Pending late 2011 Pendind late 2011
ITAR Registered Yes Yes Yes
IPC Standards Yes Yes Yes
IPC-6012 Class 1,2,& 3 Yes Yes Yes
IPC-6013 Class 1,2,& 3 Yes Yes Yes
IPC-6018 Class 1,2 & 3 Yes Yes Yes
MIL-PRF-55110 Certified FR4/GFN Yes Yes Yes
MIL-PRF-55110 Certified Polyimide/GIN Yes Yes Yes
Certified Etchback On Mil-PRF-55110 Yes Yes Yes