HDI Technology in Hole


HDI CAPABILITY1
 

High Density Interconnection


HDI CAPABILITY1
HDI CAPABILITY1
HDI CAPABILITY1
HDI CAPABILITY1
HDI CAPABILITY1
HDI CAPABILITY1

Blind & Burried 9+2+9 Laser Drill


HDI CAPABILITY1 HDI CAPABILITY1 HDI CAPABILITY1

Market Trend vs. Technology Solution


HDI CAPABILITY1

HDI Process Flow


HDI CAPABILITY1

Main Process of Build - up Layer


HDI CAPABILITY1

Construction Materials


  Material Type

            FR 4 Tetra Function ( Tg. 130 - 140 ℃ )
  FR 4 High Tg ( Tg. 160 - 180 ℃ )
  RCC ( Tg. 150 ℃ & Tg. 185 ℃ )
  Ink ( VIL )            

Comparison of Material


 
Prepreg
RCC
Low Cost
++
-
Strength
++
+
Hole wall roughness
-
+
Laminating control
+
-
Dielectric thickness
45um ~
30um ~ 80um
Smear residue on target pad
-
++
Dielectric constant
3.9 ~ 4.7
3.2 ~ 3.8
Shelf time
++
+
Working PNL size
++
+

Comparison of Via Technologies


 
Mechanical Drilling
Laser Drilling
Low Cost in Equipment
++
+
Low Cost in Production
+
++
Required Facilities
Drilling Machine
Laser Machine
Consumable
Drill Bits, Backup Board
None
Aspect Ratio
9
1
Via Size Capacity
200 um~
50~100um
Speed
140 H/min
20,000 H/min
Throughput
-
+

Comparison of Blind Via


Prepreg

HDI CAPABILITY1

RCC

HDI CAPABILITY1

Build-up for 2 + N + 2


Through Hole

HDI CAPABILITY1

Inner Laser Via

HDI CAPABILITY1

Stack Hole

HDI CAPABILITY1

Inner Via Hole

HDI CAPABILITY1

Surface Laser Via

HDI CAPABILITY1
HDI CAPABILITY1
 

Laser Via Quality


HDI CAPABILITY1

1+6+1 without buried, extend to 1+N+1


HDI CAPABILITY1

1+4+4+1 with buried via, extend to 1+N+N+1


HDI CAPABILITY1

2+4+2 laser via on laser via


HDI CAPABILITY1

2+4+2 Staggered via, extend to 2+N+2


HDI CAPABILITY1

Blind via Capability


HDI CAPABILITY1

4- Layer Core Receiving


HDI CAPABILITY1

I.V.H.(Inner Via Hole) Drilling


HDI CAPABILITY1

Electroless Copper Plating


HDI CAPABILITY1

Electro Plating


HDI CAPABILITY1

Inner Via Hole Plugging
( for thickness >= 60 mil )


HDI CAPABILITY1

I.V.H.Grinding
( for thickness >= 60 mil )


HDI CAPABILITY1

Dry Film Lamination


HDI CAPABILITY1

D.F. Exposure / Developing


HDI CAPABILITY1

Etching


HDI CAPABILITY1

D.F. Strip


HDI CAPABILITY1

Black Oxide Treatment


HDI CAPABILITY1

Prepreg Layup


HDI CAPABILITY1

Lamination


HDI CAPABILITY1

Dry Film Lamination


HDI CAPABILITY1

D.F. Exposure / Developing


HDI CAPABILITY1

Etching


HDI CAPABILITY1

D.F. Strip


HDI CAPABILITY1

Mechanical Drlling for TH


HDI CAPABILITY1

Laser Drlling for Blind Via


HDI CAPABILITY1

Desmear / Electroless Copper Plating


HDI CAPABILITY1

Electro Plating


HDI CAPABILITY1

Dry film, Exposure & DES


HDI CAPABILITY1

Solder Mask Printing


HDI CAPABILITY1

S/M Exposure / Developing


HDI CAPABILITY1

Surface Finish


HDI CAPABILITY1

Symbol Mask Printing


HDI CAPABILITY1

Inspection


HDI CAPABILITY1