Flex + Rigid Hybrid Board

FR4 & Polyimide Kapton Thick


FLEX_RIGID-FLEX
 

Flexible Board

Polyimide kapton


FLEX_RIGID-FLEX
 

Blind & Burried 1+FLEX+1 Laser drill


FLEX_RIGID-FLEX
FLEX_RIGID-FLEX
  •   Material:
  •   Flex:L2~L3 TU-768:L1~L0 L0~L4
  •   Laser:L4~L0 laser via:0.006"
  •   dielec tricthickness: 0.0035"~0.0045"
  •   No VIPPO

Construction Materials

Material Type

  •    PI thic:1~3mils
  •   Coverlay thic:2mils Ink thic:0.5~0.9mils
  •   Adhesive thic:1~2mils (Polyester)
  •   Nonflow PP 47N 49N thic:2.5mils
  •   Stiffener PI FR4 AL
  •   Copper ED RA
  •   EMI SF-PC5500 thic:0.6~0.8mils
    Cu + adhesive thic:2.4mils

    Blind vias

  •   Copper windowing
  •   Laser via
  •   Copper plating
  •   Coverlay/Soldermask
  •   Fab.: CNC, Laser cutting
  •   Stiffener

Flex Main Equipments

FLEX_RIGID-FLEX

Precision hot-Air Oven

FLEX_RIGID-FLEX

LDI


FLEX_RIGID-FLEX

Laser cutting


FLEX_RIGID-FLEX

Mass. Lam. For flex and cover lay

Material Aluminum & FLEX base


FLEX_RIGID-FLEX
FLEX_RIGID-FLEX
  • Material-

  •   FR4-ISOLA370HR Aluminu flex

Capability

FLEX_RIGID-FLEX
FLEX_RIGID-FLEX